Daily Papers

Large language models (LLMs) have revolutionized Natural Language Processing (NLP), but their size creates computational bottlenecks. We introduce a novel approach to create accurate, sparse foundational versions of performant LLMs that achieve full accuracy recovery for fine-tuning tasks at up to 70% sparsity. We achieve this for the LLaMA-2 7B model by combining the SparseGPT one-shot pruning method and sparse pretraining of those models on a subset of the SlimPajama dataset mixed with a Python subset of The Stack dataset. We exhibit training acceleration due to sparsity on Cerebras CS-3 chips that closely matches theoretical scaling. In addition, we establish inference acceleration of up to 3x on CPUs by utilizing Neural Magic's DeepSparse engine and 1.7x on GPUs through Neural Magic's nm-vllm engine. The above gains are realized via sparsity alone, thus enabling further gains through additional use of quantization. Specifically, we show a total speedup on CPUs for sparse-quantized LLaMA models of up to 8.6x. We demonstrate these results across diverse, challenging tasks, including chat, instruction following, code generation, arithmetic reasoning, and summarization to prove their generality. This work paves the way for rapidly creating smaller and faster LLMs without sacrificing accuracy.

Emerging AI accelerators increasingly adopt wafer-scale manufacturing technologies, integrating hundreds of thousands of AI cores in a mesh architecture with large distributed on-chip memory (tens of GB in total) and ultra-high on-chip memory bandwidth (tens of PB/s). However, current LLM inference systems, optimized for shared memory architectures like GPUs, fail to exploit these accelerators fully. We introduce WaferLLM, the first wafer-scale LLM inference system. WaferLLM is guided by a novel PLMR model (pronounced as "Plummer") that captures the unique hardware characteristics of wafer-scale architectures. Leveraging this model, WaferLLM pioneers wafer-scale LLM parallelism, optimizing the utilization of hundreds of thousands of on-chip cores. It also introduces MeshGEMM and MeshGEMV, the first GEMM and GEMV implementations designed to scale effectively on wafer-scale accelerators. Evaluations show that WaferLLM achieves up to 200times higher accelerator utilization than state-of-the-art methods. Leveraging a wafer-scale accelerator (Cerebras WSE2), WaferLLM delivers GEMV operations 606times faster and 16times more energy-efficient than on an NVIDIA A100 GPU. For full LLM inference, WaferLLM achieves 10-20times speedups over A100 GPU clusters running SGLang and vLLM. These advantages are expected to grow as wafer-scale AI models, software, and hardware continue to mature. WaferLLM is open-sourced at https://github.com/MeshInfra/WaferLLM.

Implanted devices providing real-time neural activity classification and control are increasingly used to treat neurological disorders, such as epilepsy and Parkinson's disease. Classification performance is critical to identifying brain states appropriate for the therapeutic action. However, advanced algorithms that have shown promise in offline studies, in particular deep learning (DL) methods, have not been deployed on resource-restrained neural implants. Here, we designed and optimized three embedded DL models of commonly adopted architectures and evaluated their inference performance in a case study of seizure detection. A deep neural network (DNN), a convolutional neural network (CNN), and a long short-term memory (LSTM) network were designed to classify ictal, preictal, and interictal phases from the CHB-MIT scalp EEG database. After iterative model compression and quantization, the algorithms were deployed on a general-purpose, off-the-shelf microcontroller. Inference sensitivity, false positive rate, execution time, memory size, and power consumption were quantified. For seizure event detection, the sensitivity and FPR (h-1) for the DNN, CNN, and LSTM models were 87.36%/0.169, 96.70%/0.102, and 97.61%/0.071, respectively. Predicting seizures for early warnings was also feasible. The implemented compression and quantization achieved a significant saving of power and memory with an accuracy degradation of less than 0.5%. Edge DL models achieved performance comparable to many prior implementations that had no time or computational resource limitations. Generic microcontrollers can provide the required memory and computational resources, while model designs can be migrated to ASICs for further optimization. The results suggest that edge DL inference is a feasible option for future neural implants to improve classification performance and therapeutic outcomes.

Emerging Artificial Intelligence-enabled Internet-of-Things (AI-IoT) System-on-a-Chip (SoC) for augmented reality, personalized healthcare, and nano-robotics need to run many diverse tasks within a power envelope of a few tens of mW over a wide range of operating conditions: compute-intensive but strongly quantized Deep Neural Network (DNN) inference, as well as signal processing and control requiring high-precision floating-point. We present Marsellus, an all-digital heterogeneous SoC for AI-IoT end-nodes fabricated in GlobalFoundries 22nm FDX that combines 1) a general-purpose cluster of 16 RISC-V Digital Signal Processing (DSP) cores attuned for the execution of a diverse range of workloads exploiting 4-bit and 2-bit arithmetic extensions (XpulpNN), combined with fused MAC&LOAD operations and floating-point support; 2) a 2-8bit Reconfigurable Binary Engine (RBE) to accelerate 3x3 and 1x1 (pointwise) convolutions in DNNs; 3) a set of On-Chip Monitoring (OCM) blocks connected to an Adaptive Body Biasing (ABB) generator and a hardware control loop, enabling on-the-fly adaptation of transistor threshold voltages. Marsellus achieves up to 180 Gop/s or 3.32 Top/s/W on 2-bit precision arithmetic in software, and up to 637 Gop/s or 12.4 Top/s/W on hardware-accelerated DNN layers.

We introduce Gemma 3, a multimodal addition to the Gemma family of lightweight open models, ranging in scale from 1 to 27 billion parameters. This version introduces vision understanding abilities, a wider coverage of languages and longer context - at least 128K tokens. We also change the architecture of the model to reduce the KV-cache memory that tends to explode with long context. This is achieved by increasing the ratio of local to global attention layers, and keeping the span on local attention short. The Gemma 3 models are trained with distillation and achieve superior performance to Gemma 2 for both pre-trained and instruction finetuned versions. In particular, our novel post-training recipe significantly improves the math, chat, instruction-following and multilingual abilities, making Gemma3-4B-IT competitive with Gemma2-27B-IT and Gemma3-27B-IT comparable to Gemini-1.5-Pro across benchmarks. We release all our models to the community.

While Large Language Models (LLMs) demonstrate immense potential for automating integrated circuit (IC) development, their practical deployment is fundamentally limited by restricted context windows. Existing context-extension methods struggle to achieve effective semantic modeling and thorough multi-hop reasoning over extensive, intricate circuit specifications. To address this, we introduce ChipMind, a novel knowledge graph-augmented reasoning framework specifically designed for lengthy IC specifications. ChipMind first transforms circuit specifications into a domain-specific knowledge graph ChipKG through the Circuit Semantic-Aware Knowledge Graph Construction methodology. It then leverages the ChipKG-Augmented Reasoning mechanism, combining information-theoretic adaptive retrieval to dynamically trace logical dependencies with intent-aware semantic filtering to prune irrelevant noise, effectively balancing retrieval completeness and precision. Evaluated on an industrial-scale specification reasoning benchmark, ChipMind significantly outperforms state-of-the-art baselines, achieving an average improvement of 34.59% (up to 72.73%). Our framework bridges a critical gap between academic research and practical industrial deployment of LLM-aided Hardware Design (LAD).

This work proposes XR-NPE, a high-throughput Mixed-precision SIMD Neural Processing Engine, designed for extended reality (XR) perception workloads like visual inertial odometry (VIO), object classification, and eye gaze extraction. XR-NPE is first to support FP4, Posit (4,1), Posit (8,0), and Posit (16,1) formats, with layer adaptive hybrid-algorithmic implementation supporting ultra-low bit precision to significantly reduce memory bandwidth requirements, and accompanied by quantization-aware training for minimal accuracy loss. The proposed Reconfigurable Mantissa Multiplication and Exponent processing Circuitry (RMMEC) reduces dark silicon in the SIMD MAC compute engine, assisted by selective power gating to reduce energy consumption, providing 2.85x improved arithmetic intensity. XR-NPE achieves a maximum operating frequency of 1.72 GHz, area 0.016 mm2 , and arithmetic intensity 14 pJ at CMOS 28nm, reducing 42% area, 38% power compared to the best of state-of-the-art MAC approaches. The proposed XR-NPE based AXI-enabled Matrix-multiplication co-processor consumes 1.4x fewer LUTs, 1.77x fewer FFs, and provides 1.2x better energy efficiency compared to SoTA accelerators on VCU129. The proposed co-processor provides 23% better energy efficiency and 4% better compute density for VIO workloads. XR-NPE establishes itself as a scalable, precision-adaptive compute engine for future resource-constrained XR devices. The complete set for codes for results reproducibility are released publicly, enabling designers and researchers to readily adopt and build upon them. https://github.com/mukullokhande99/XR-NPE.

In this work, we present the Megrez models, comprising a language model (Megrez-3B-Instruct) and a multimodal model (Megrez-3B-Omni). These models are designed to deliver fast inference, compactness, and robust edge-side intelligence through a software-hardware co-design approach. Megrez-3B-Instruct offers several advantages, including high accuracy, high speed, ease of use, and a wide range of applications. Building on Megrez-3B-Instruct, Megrez-3B-Omni is an on-device multimodal understanding LLM that supports image, text, and audio analysis. It achieves state-of-the-art accuracy across all three modalities and demonstrates strong versatility and robustness, setting a new benchmark for multimodal AI models.

Front-end electronics equipped with high-speed digitizers are being used and proposed for future nuclear detectors. Recent literature reveals that deep learning models, especially one-dimensional convolutional neural networks, are promising when dealing with digital signals from nuclear detectors. Simulations and experiments demonstrate the satisfactory accuracy and additional benefits of neural networks in this area. However, specific hardware accelerating such models for online operations still needs to be studied. In this work, we introduce PulseDL-II, a system-on-chip (SoC) specially designed for applications of event feature (time, energy, etc.) extraction from pulses with deep learning. Based on the previous version, PulseDL-II incorporates a RISC CPU into the system structure for better functional flexibility and integrity. The neural network accelerator in the SoC adopts a three-level (arithmetic unit, processing element, neural network) hierarchical architecture and facilitates parameter optimization of the digital design. Furthermore, we devise a quantization scheme compatible with deep learning frameworks (e.g., TensorFlow) within a selected subset of layer types. We validate the correct operations of PulseDL-II on field programmable gate arrays (FPGA) alone and with an experimental setup comprising a direct digital synthesis (DDS) and analog-to-digital converters (ADC). The proposed system achieved 60 ps time resolution and 0.40% energy resolution at signal to noise ratio (SNR) of 47.4 dB.